Uniwell Circuits provides a variety of 6 layers circuit board products, including , hybrid boards, suitable for high-density and high-performance electronic device manufacturing, supporting one-stop production services from samples to batches.
6 layer Rigid Flex board
Structure: 8 layers of rigid and flexible board, including 6 layers of flexible board
Plate thickness: 1.6mm
Features: Suitable for high-end equipment that requires curved wiring and 3D assembly, such as medical electronics, aerospace, etc.
6 layer HDI board (high-density interconnect)
Stacked structure: 2+2+2
Completed board thickness: 0.6mm
Process: Support blind hole design (1-2, 2-3, 1-3, etc.) to improve wiring density.
Application: Suitable for miniaturized products such as portable smart terminals and wearable devices.
6 layer RO4350B+high TG mixed pressure plate
Material: RO4350B (high-frequency material) mixed with high TG FR-4
Process: Copper paste plug hole and disc hole technology.
Advantages: Balancing high-frequency signal transmission performance and structural strength, suitable for communication base stations, radar systems, etc.
Universal 6 layers pcb sampling service
Support flexible stacking design (2+2+2 or 1+4+1)
Minimum line width/spacing: 3/3mil
Aperture: Mechanical drilling 0.2mm, laser drilling 0.1mm
Impedance control accuracy: ± 10%
Yield guarantee: AOI full inspection+flying needle testing, with a yield rate of 99.2%
<0.7% to ensure interlayer alignment accuracy.
Lead free environmental protection process: compliant with RoHS and UL certification, meeting export requirements.
One stop service: covering the entire process from design support, rapid prototyping to mass production.