In the cutting-edge technology fields of modern wireless communication, radar detection, and satellite communication, the shoulders the key mission of signal processing and transmission. As the core components of these systems, the characteristics, design ideas, and manufacturing processes of their boards play a decisive role in overall performance.
1, Characteristics of RF microwave control board
(1) Low dielectric constant and low loss
high-frequency environment with extremely fast signal transmission rates. The board needs to have a low dielectric constant to reduce signal transmission delay. For example, in the 5G communication frequency band, the signal frequency can reach several GHz, and the low dielectric constant can significantly reduce the phase lag of the signal during transmission, ensuring high-speed data transmission. Meanwhile, low dielectric loss is crucial to prevent signal attenuation and distortion due to energy loss. Polytetrafluoroethylene based composite materials, due to their excellent low dielectric properties, have become commonly used boards for high-frequency RF microwave control boards.
(2) Good thermal stability
When electronic devices are working, the RF microwave control board generates heat due to the passage of current. Stable thermal performance is the key to ensuring its reliable operation. The board should be able to withstand high temperatures without deformation or softening, and maintain stable physical and electrical properties. For example, under long-term high-power operation of the radar system, the control board needs to withstand high temperature tests. Ceramic filled epoxy resin boards have good thermal stability and can effectively cope with such scenarios, ensuring accurate radar detection.
(3) High flatness and consistency
RF microwave signals require extremely high flatness for transmission lines. Even small fluctuations on the surface of the board can cause signal reflection and scattering, affecting transmission quality. Therefore, the RF microwave control board board needs to have high flatness and strong consistency in performance between batches. Through advanced rolling technology and strict quality control, we ensure that every sheet can provide a stable and reliable physical foundation for signal transmission, ensuring stable signal transmission in large-scale application scenarios such as communication base stations.
2, Design points
(1) Line layout and impedance matching
The layout of the RF microwave control board circuit needs to be carefully planned to reduce signal interference. The signal line should be as short and straight as possible, avoiding right or sharp turns to prevent signal reflection. Meanwhile, impedance matching is the core of the design. The connection between different functional modules, such as from the RF chip to the antenna, needs to ensure consistent line impedance to enable efficient signal transmission and reduce energy loss and reflection. By using professional electromagnetic simulation software, the impedance of the circuit is accurately calculated and optimized to ensure the efficiency and stability of signal transmission.
(2) Grounding design
Good grounding design is the key to suppressing RF microwave interference. A large grounding plane can provide a low impedance return path, reducing signal noise. For example, when using a multi-layer board structure, a reasonable grounding layer should be set to effectively partition the grounding of different functional circuits and avoid mutual interference. At the same time, grounding vias are set up next to key components to ensure fast and stable grounding connections and enhance the overall anti-interference ability of the control board.
3, Manufacturing process
(1) High precision drilling
On the RF microwave control board, vias are the key to connecting different layers of circuits. High precision drilling technology is crucial, and aperture deviation should be controlled within a very small range to avoid affecting signal transmission. Laser drilling technology, with its advantages of high precision and low thermal impact zone, is widely used in the manufacturing of RF microwave control boards, which can meet the drilling requirements of small aperture and high aspect ratio, ensuring precise connection between various layers of circuits.
(2) Fine line etching
To meet the strict requirements for line accuracy in RF microwave signal transmission, fine line etching technology is indispensable. By using photolithography technology, the designed circuit pattern is transferred onto a copper-clad laminate, and then the excess copper foil is precisely removed using etching solution to form a fine circuit. Advanced etching technology can achieve extremely fine line width and spacing, for example, in high-end 5G communication RF microwave control boards, it can achieve micrometer level line width accuracy, ensuring stable signal transmission in small circuits.
(3) Multi layer board compression
Multilayer board structure can effectively increase circuit integration and optimize signal transmission paths. During the lamination process of multi-layer boards, it is necessary to strictly control the temperature, pressure, and time parameters. Under high temperature and pressure, ensure that each layer of the board is tightly bonded to the semi cured sheet to prevent defects such as delamination and bubbles. At the same time, precise control of the thickness and flatness of the pressed board meets the strict requirements of RF microwave control board for dimensional accuracy and signal transmission performance.
high-frequency